CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment 2026 Grant
••••• organisation
An organisation
In context
This call is open to large companies, consortia and small and medium-sized businesses, at scale-up and mature. Funding is a grant. Coverage is read from the notice itself: United States.
Summary
This programme provides incentives for construction and equipment of semiconductor manufacturing and materials facilities in the United States. It targets large manufacturers and consortia seeking to establish or expand domestic chip production capacity.
Summary by Raise Lens from the official notice · 3 Oct 2026Accurate?
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Frequently asked questions
- When is the CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment deadline?
- Applications close 1 Nov 2026.
- Who can apply for CHIPS Incentives Program – Facilities for Semiconductor Materials and Manufacturing Equipment?
- Eligibility covers organisations in US; large-company, consortium, sme. The full eligibility conditions are part of the Pro detail.
Relevant sectors
Quick facts
Opens29 Sep 2023
EligibilityUS
Org typeslarge-company, consortium, sme
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